ALEXANDRIA, Va., March 17 -- United States Patent no. 12,580,331, issued on March 17, was assigned to MEKTEC Corp. (Tokyo).
"Flexible printed wiring board with crimp terminal" was invented by Shuzo Yamada (Tokyo), Yu Miura (Tokyo) and Tomoki Kanayama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed wiring board with crimp terminal includes: a flexible printed wiring board having a base film, a circuit including a metal foil provided on a surface of the base film, and a cover film attached to the base film so as to sandwich the circuit; and a crimp terminal with a plurality of crimping pieces that penetrates the flexible printed wiring board by being crimped and is bent to bite into a ...