US Patent Issued to MEIKO ELECTRONICS on Oct. 20 for "Device embedded substrate and manufacturing method of same" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,369, issued on Oct. 20, was assigned to MEIKO ELECTRONICS Co. LTD. (Ayase, Japan).

"Device embedded substrate and manufacturing method of same" was invented by Tohru Matsumoto (Ayase, Japan), Masakatsu Ishihara (Ayase, Japan), Kazuhiro Beniya (Ayase, Japan) and Kentaro Aoki (Ayase, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device embedded substrate provided with first and second connecting terminals on different surfaces, the substrate including: an electrically conductive metal block having one surface connected to the first connecting terminal, and having a dimension in a lateral direction larger than that of the electronic device; an...