US Patent Issued to MEDIATEK SINGAPORE on Nov. 3 for "Semiconductor package structure" (Singaporean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,894, issued on Nov. 3, was assigned to MEDIATEK SINGAPORE PTE. LTD. (Singapore).

"Semiconductor package structure" was invented by Jubao Zhang (Singapore), Zhigang Duan (Singapore), Chang Liang (Singapore) and Lian Duan (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package structure includes a substrate, a composite interposer, and a semiconductor die. The composite interposer is disposed over the substrate and includes a first interposer substrate and a second interposer substrate. The first interposer substrate includes a first conductive via and a first dielectric layer. The second interposer substrate is disposed over ...