US Patent Issued to MediaTek on Oct. 27 for "High-bandwidth package-on-package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,777,973, issued on Oct. 27, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"High-bandwidth package-on-package structure" was invented by Tai-Yu Chen (Hsinchu City, Taiwan), Bo-Jiun Yang (Hsinchu City, Taiwan), Tsung-Yu Pan (Hsinchu City, Taiwan), Yin-Fa Chen (Hsinchu City, Taiwan), Ta-Jen Yu (Hsinchu City, Taiwan), Bo-Hao Ma (Hsinchu City, Taiwan), Wen-Sung Hsu (Hsinchu City, Taiwan) and Yao-Pang Hsu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-bandwidth package-on-package (HBPoP) structure includes a first package structure and a second package structure disposed over the first package structure. The first package ...