US Patent Issued to MediaTek on Nov. 3 for "Semiconductor package and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,883, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor package and fabrication method thereof" was invented by Pei-Haw Tsao (Hsinchu City, Taiwan) and Te-Chi Wong (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a package substrate, an interposer on and electrically connected to the package substrate, a central logic die disposed on and electrically connected to the interposer, peripheral function dies disposed on and electrically connected to the interposer and located in proximity to the central logic die, and at least one dummy die disposed between the centra...