US Patent Issued to MediaTek on Nov. 3 for "Semiconductor devices with in-package PGS for coupling noise suppression" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,787, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).

"Semiconductor devices with in-package PGS for coupling noise suppression" was invented by Ruey-Bo Sun (Hsinchu City, Taiwan) and Sheng-Mou Lin (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "According to an embodiment of the invention, a semiconductor device comprises a substrate, a semiconductor die and a first shielding structure. The semiconductor die is disposed on the substrate and comprises an electronic device. The first shielding structure is formed outside of the semiconductor die and disposed under the electronic device."

The patent was filed...