ALEXANDRIA, Va., June 2 -- United States Patent no. 12,648,497, issued on June 2, was assigned to MediaTek Inc. (Hsinchu City, Taiwan).
"Semiconductor package using substrate block integration" was invented by Wei-Chih Chen (Hsinchu City, Taiwan) and Shi-Bai Chen (Hsinchu City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a partitioned package substrate composed of substrate parts arranged in a side-by-side manner; an integrated circuit die mounted on a first surface of the partitioned package substrate; and solder balls mounted on a second surface of the partitioned package substrate opposite to the first surface."
The patent was filed on June 29, 2023, under Appli...