ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,063, issued on Feb. 24, was assigned to MediaTek Inc. (Hsinchu, Taiwan).
"Package-level ESD protection" was invented by Yu-Cheng Liao (Hsinchu, Taiwan), Bo-Shih Huang (Hsinchu, Taiwan), Che-Yuan Jao (Hsinchu, Taiwan) and Yi-Chieh Lin (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a package including a first pad, a die and at least one package ESD component is disclosed. The first pad is configured to receive a signal from a device external to the package. The die comprises a second pad and an internal circuit, wherein the internal circuit is configured to receive the signal from the first pad via the s...