US Patent Issued to Max on Oct. 20 for "Staple removing device" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,766,685, issued on Oct. 20, was assigned to Max Co. Ltd. (Tokyo).

"Staple removing device" was invented by Tomokazu Nagata (Tokyo) and Katsuya Hakozaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A staple removing device includes a placement portion having a placement surface on which a paper bundle bound by a staple is to be placed, a rotating shaft, and a removal unit attached to the rotating shaft and rotating along a surface intersecting an axial direction of the rotating shaft. The removal unit includes a tip portion to be inserted between a lower surface of the paper bundle placed on the placement surface and a crown portion of the stapl...