US Patent Issued to Max on June 23 for "Binding device" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,275, issued on June 23, was assigned to Max Co. Ltd. (Tokyo).

"Binding device" was invented by Akira Kasahara (Tokyo), Shigeki Shindou (Tokyo) and Yosei Nodaguchi (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A binding device includes a main body part and a traveling part configured to travel the main body part. The main body part includes a binding mechanism configured to feed a plurality of wires around a reinforcing bar, and to twist and bind the plurality of wires fed around the reinforcing bar, a binding mechanism moving part configured to move the binding mechanism between a binding position where binding of the reinforcing bar is perf...