US Patent Issued to Max on June 2 for "Binding device" (Japanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,643,140, issued on June 2, was assigned to Max Co. Ltd. (Tokyo).

"Binding device" was invented by Akira Kasahara (Tokyo), Kenichi Arai (Tokyo) and Shigeki Shindou (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A binding device includes a binding mechanism configured to feed a wire around a reinforcing bar, and to twist and bind the wire fed around the reinforcing bar, a binding mechanism moving part configured to move the binding mechanism between a binding position where binding of the reinforcing bar is performed and a retreat position distant from the reinforcing bar, and a wire pull-out part configured to pull out the wire wound on the reel. T...