US Patent Issued to Massachusetts Institute of Technology on Oct. 27 for "High-throughput electroporation assembly" (Massachusetts Inventors)

ALEXANDRIA, Va., Oct. 27 -- United States Patent no. 12,774,444, issued on Oct. 27, was assigned to Massachusetts Institute of Technology (Cambridge, Mass.).

"High-throughput electroporation assembly" was invented by Po-Hsun Huang (Quincy, Mass.), Cullen Richard Buie (Cambridge, Mass.) and Sijie Chen (Cambridge, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electroporation assembly for interfacing with a liquid handling system includes at least two electrically conductive layer components and a channel layer component. The channel layer component is configured to be removably disposed between the electrically conductive layer components. The electrically conductive layer components and the channel ...