US Patent Issued to Marvell Asia on May 19 for "Warpage-resilient attachment of die to substrate in mass reflow soldering" (California Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,081, issued on May 19, was assigned to Marvell Asia Pte Ltd (Singapore).

"Warpage-resilient attachment of die to substrate in mass reflow soldering" was invented by Hsiu-Che Wang (Oak Park, Calif.), Dwayne R Shirley (Valley Glen, Calif.), Roberto Coccioli (Simi Valley, Calif.) and Pushkraj Tumne (Agoura Hills, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating electronic devices includes applying an array of non-uniformly sized spots of solder material on a substrate. An average size of the spots is larger in a center portion of the array than in a peripheral portion of the array. A die is soldered to the substrate using t...