US Patent Issued to MARVELL ASIA on March 24 for "Methods for assembling stacked substrate packages including dies, laminated base substrates, and dielectric build-up substrates" (New York, Texas, Vermont, Maine Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,470, issued on March 24, was assigned to MARVELL ASIA PTE LTD (Singapore).

"Methods for assembling stacked substrate packages including dies, laminated base substrates, and dielectric build-up substrates" was invented by Richard Graf (Gray, Maine), Luke England (Lakeway, Texas), Manish Nayini (Wappingers Falls, N.Y.) and Janak G. Patel (South Burlington, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for assembling a stacked substrate package includes: a) binding a laminated base substrate, configured to route interconnections between first and second surfaces of the laminated base substrate, to a rigid carrier to prevent warping of th...