US Patent Issued to MARVELL ASIA on July 28 for "Carrier die with micro channel cooling and embedded components" (Vermont, New York, California Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,808, issued on July 28, was assigned to MARVELL ASIA PTE LTD (Singapore).

"Carrier die with micro channel cooling and embedded components" was invented by John E. Gregory Jr. (Dummerston, Vt.), Eva Shah Holmes (Wappingers Falls, N.Y.), Carlos Macian Ruiz (Los Gatos, Calif.), Mark William Kuemerle (Essex Junction, Vt.), Wolfgang Sauter (Burke, Vt.), Aatreya Chakravarti (Willston, Vt.) and Samer Michael Akiki (Burlington, Vt.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A three-dimensional (3D) integrated circuit (IC) includes a plurality of dies, a carrier die, and a plurality of channels embedded in the carrier die. The plurality of dies is stacke...