US Patent Issued to MACRONIX INTERNATIONAL on March 24 for "3D hybrid bonding 3D memory devices with NPU/CPU for AI inference application" (New York Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,585,931, issued on March 24, was assigned to MACRONIX INTERNATIONAL Co. LTD. (Hsinchu, Taiwan).

"3D hybrid bonding 3D memory devices with NPU/CPU for AI inference application" was invented by Hsiang-Lan Lung (Ardsley, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An AI inference platform comprises a logic die including an array of AI processing elements. Each AI processing element including an activation memory storing activation data for use in neural network computations. The platform includes a memory die that includes an array of 3D memory cells and a page buffer that facilitates storage and retrieval of neural network weights for use in neur...