US Patent Issued to MACOM TECHNOLOGY SOLUTIONS HOLDINGS on Sept. 8 for "Unibody lateral via" (Massachusetts, California, New Hampshire Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,474, issued on Sept. 8, was assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS INC. (Lowell, Mass.).

"Unibody lateral via" was invented by Andrzej Rozbicki (Saratoga, Calif.), Belinda Simone Edmee Piernas (Mason, N.H.), David Russell Hoag (Walpole, Mass.), James Joseph Brogle (Merrimac, Mass.) and Timothy Edward Boles (Tyngsboro, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Semiconductor devices are described. In one example, the semiconductor device includes a substrate, a layer of first semiconductor material over the substrate, a layer of second semiconductor material over the layer of first semiconductor material, a first metal contact form...