US Patent Issued to MACOM Technology Solutions Holdings on July 21 for "Solderable and wire bondable part marking" (Massachusetts Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,466, issued on July 21, was assigned to MACOM Technology Solutions Holdings Inc. (Lowell, Mass.).

"Solderable and wire bondable part marking" was invented by Margaret Barter (Lowell, Mass.) and Timothy Boles (Lowell, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique for marking semiconductor devices with an identifiable mark or alphanumeric text yields a high-contrast, easily distinguishable mark on an electrical terminal of the device without impacting the device's breakdown voltage capability and without compromising the solderability and wire bondability of the terminal. This approach deposits the mark on the terminal as a patterne...