US Patent Issued to MACOM TECHNOLOGY SOLUTIONS HOLDINGS on July 21 for "Metal pillar connection topologies for heterogeneous packaging" (North Carolina, California Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,254, issued on July 21, was assigned to MACOM TECHNOLOGY SOLUTIONS HOLDINGS INC. (Lowell, Mass.).

"Metal pillar connection topologies for heterogeneous packaging" was invented by Fabian Radulescu (Chapel Hill, N.C.), Basim Noori (San Jose, Calif.), Scott Sheppard (Chapel Hill, N.C.) and Kwangmo Chris Lim (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A radio frequency ("RF") transistor amplifier die includes a semiconductor layer structure having a plurality of transistor cells, and an insulating layer on a surface of the semiconductor layer structure. Conductive pillar structures protrude from the insulating layer opposite the sur...