US Patent Issued to MacDermid Enthone on Feb. 17 for "Bendable nickel plating on flexible substrates" (Connecticut Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,553,134, issued on Feb. 17, was assigned to MacDermid Enthone Inc. (Waterbury, Conn.).

"Bendable nickel plating on flexible substrates" was invented by Aparna Iyer (Unionville, Conn.), Ernest Long (Burlington, Conn.) and Kishore Viswanathan (Unionville, Conn.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of producing a flexible nickel phosphorus plating layer on a substrate. The substrate comprises a dielectric material with a copper layer thereon. The method includes the steps of (1) activating the substrate with a palladium activation solution to catalyze the substrate, and (2) contacting the activated substrate with an electroless nickel ph...