US Patent Issued to LX SEMICON on Aug. 4 for "Double-sided heat dissipation power semiconductor module and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,002, issued on Aug. 4, was assigned to LX SEMICON Co. LTD (Daejeon, South Korea).

"Double-sided heat dissipation power semiconductor module and method of manufacturing the same" was invented by Deog Soo Kim (Daejeon, South Korea) and Tae Ryong Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a technology relating to a power semiconductor module of which heat is dissipated through both sides thereof and provides a technology for maintaining a distance between an upper substrate and a lower substrate by a metal bump formed on one side of a power semiconductor die."

The patent was filed on Dec. ...