US Patent Issued to LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) on July 14 for "Multi-chip packaging method" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,210, issued on July 14, was assigned to LUXIS PRECISION INTELLIGENT MANUFACTURING (KUNSHAN) Co. LTD. (Kunshan City, China).

"Multi-chip packaging method" was invented by Yijun Ye (Kunshan City, China), Guoqing Yu (Kunshan City, China) and Jie Hao (Kunshan City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multi-chip packaging method includes: flip-mounting a first chip on a substrate on which first metal posts are arranged; mold packaging the first metal posts and the first chip to obtain a first package; forming a first redistribution layer on the surface of the first package; flip-mounting a second chip on a surface of the first redistri...