US Patent Issued to Lux Semiconductors on Nov. 3 for "Metal core substrate based package interconnect systems" (New York Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,817, issued on Nov. 3, was assigned to Lux Semiconductors Inc. (Albany, N.Y.).

"Metal core substrate based package interconnect systems" was invented by Chad B. Moore (Albany, N.Y.), Graeme Housser (Albany, N.Y.) and Shane McMahon (Albany, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Metal core substrates made with a medal core patterned with metal in-substrate structures therethrough of the same metal and insolated from the metal core with dielectric in-substrate structures patterned therethrough can include interconnect structures deposited on top and back side surfaces thereof. The interconnect structures can include metal interconnect stru...