ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,223, issued on Nov. 3, was assigned to LOTUS THERMAL SOLUTION INC. (Osaka, Japan).

"Ebullition cooling device" was invented by Takuya Ide (Osaka, Japan), Masaaki Murakami (Osaka, Japan) and Tomiyuki Numata (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an ebullition cooling device, one opening of each of through holes faces an uneven surface, and the other opening of each of the through holes is opened to a space on a side opposite to the uneven surface. At least the uneven surface of a heat transfer wall and a metal porous body are immersed in a refrigerant liquid. The uneven surface of the heat transfer wall is a vertical surface o...