US Patent Issued to Logitech Europe on Feb. 24 for "Techniques for soldering on a substrate with a below soldering temperature melting point" (Swiss Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,541, issued on Feb. 24, was assigned to Logitech Europe S.A. (Lausanne, Switzerland).

"Techniques for soldering on a substrate with a below soldering temperature melting point" was invented by Laurent Plancherel (Lausanne, Switzerland) and Thomas Marriott-Dodington (Geneva).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for soldering to a conductor on a first substrate with a melting temperature below a soldering temperature is provided. A second substrate is attached to the first substrate around a soldering point. The second substrate is smaller than the first substrate and has a melting temperature above the soldering temperature. A solde...