US Patent Issued to Littelfuse Semiconductor (Wuxi) on March 17 for "Small outline TVS package compromising lead clip coin structure to support a semiconductor device" (Chinese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,963, issued on March 17, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China).

"Small outline TVS package compromising lead clip coin structure to support a semiconductor device" was invented by Lucas Zhang (Wuxi, China), Charlie Cai (Wuxi, China) and Jifeng Zhou (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A discrete semiconductor package includes a semiconductor device, a left lead, and a right lead. The semiconductor device has a first side and a second side, the second side being opposite the first side. The left lead has a left terminal and a platform to support the semiconductor device on the first side. The r...