US Patent Issued to Littelfuse Semiconductor (Wuxi) on July 21 for "Package structure assembly for TVS devices" (Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,472, issued on July 21, was assigned to Littelfuse Semiconductor (Wuxi) Co. Ltd. (Wuxi, China).

"Package structure assembly for TVS devices" was invented by Lucas Zhang (Wuxi, China), Chao Gao (Wuxi, China) and Glenda Zhang (Wuxi, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided herein are package structures including a first lead frame having a first pedestal and a first lead extending from the first pedestal. A first perimeter ridge defines a first recessed area in a first main side of the first pedestal, wherein a die pad is positioned within the first recessed area. The package structure may further include a chip layer having a fir...