ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,602, issued on March 3, was assigned to LINTEC Corp. (Tokyo).
"High-frequency dielectric heating adhesive sheet" was invented by Yuichi Mori (Tokyo) and Naoki Taya (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency-dielectric-heating-adhesive-sheet includes: a first adhesive layer containing a first thermoplastic resin; a second adhesive layer containing a second thermoplastic resin; and an intermediate layer, a ratio DPM/DP1 of dielectric property DPM of the intermediate layer to dielectric property DP1 of the first adhesive layer and a ratio DPM/DP2 of the dielectric property DPM of the intermediate layer to dielectric property...