US Patent Issued to LINTEC on Feb. 24 for "High-frequency dielectric heating adhesive sheet, joining method, and joined body" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,654, issued on Feb. 24, was assigned to LINTEC Corp. (Tokyo).

"High-frequency dielectric heating adhesive sheet, joining method, and joined body" was invented by Koji Tsuchibuchi (Tokyo) and Naoki Taya (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A high-frequency dielectric heating adhesive sheet includes an adhesive layer. The adhesive layer contains a thermoplastic resin having a reactive site, a dielectric filler that generates heat upon application of a high-frequency electric field, and a silane coupling agent."

The patent was filed on June 25, 2021, under Application No. 18/012,852.

*For further information, including images, charts...