ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,354, issued on July 7, was assigned to LINTEC Corportaion (Tokyo).
"Wiring sheet" was invented by Takuya Oshima (Tokyo) and Takashi Morioka (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C. of the cured product layer is in a range from 5.0x106 Pa to 1.0x1010 Pa."
The ...