US Patent Issued to LG INNOTEK on Sept. 29 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,751,302, issued on Sept. 29, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Myung Jae Kwon (Seoul, South Korea), Sang Hyuck Nam (Seoul, South Korea) and Sang Hyun Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes an insulating layer, a first circuit pattern layer, and a first protective layer having a width narrower than a width of the insulating layer. Further. a second circuit pattern layer is disposed under the insulating layer, and a second protective layer also disposed under the second circu...