US Patent Issued to LG INNOTEK on Oct. 6 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,757,775, issued on Oct. 6, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Han Sang Kim (Seoul, South Korea), Bo Ra Kang (Seoul, South Korea) and Jeong Han Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes an insulating layer; and a circuit pattern layer disposed on the insulating layer, wherein the insulating layer includes a surface layer containing fluorine (F), and the circuit pattern layer is disposed on the surface layer of the insulating layer."

The patent was filed on Sept. 30, 2022, under A...