US Patent Issued to LG INNOTEK on March 31 for "Circuit board and semiconductor package comprising same" (South Korean Inventor)

ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,405, issued on March 31, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Jae Man Bae (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes an insulating layer including an upper and lower surface; and a through electrode passing through the upper and lower surfaces of the insulating layer and having a first inclination whose width gradually decreases toward the lower surface of the insulating layer, and wherein the through electrode includes a void portion having an inclination different from the first...