US Patent Issued to LG INNOTEK on March 17 for "Circuit board and semiconductor package board comprising same" (South Korean Inventor)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,967, issued on March 17, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package board comprising same" was invented by Il Sik Nam (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes an insulating layer; a circuit pattern disposed on the insulating layer, and a first protective layer disposed on the insulating layer, wherein the first protective layer includes a first opening vertically overlapping at least a part of an upper surface of the circuit pattern; wherein an inner wall of the first protective layer constituting the first opening i...