US Patent Issued to LG INNOTEK on July 7 for "Circuit board and package substrate comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,382, issued on July 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and package substrate comprising same" was invented by Jong Bae Shin (Seoul, South Korea), Soo Min Lee (Seoul, South Korea) and Jae Hun Jeong (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer and including a cavity; a pad disposed on the first insulating layer and having a top surface exposed through the cavity; wherein the cavity of the second insulating layer includes: a bottom surface positioned ...