US Patent Issued to LG INNOTEK on July 28 for "Circuit board and semiconductor package comprising same" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,390, issued on July 28, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Circuit board and semiconductor package comprising same" was invented by Yong Suk Kim (Seoul, South Korea), Bo Ra Kang (Seoul, South Korea) and Jeong Han Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board according to an embodiment includes a first insulating layer, a coating layer disposed on the first insulating layer, and a circuit pattern layer disposed on the coating layer, wherein the circuit pattern layer includes a first metal layer disposed on the coating layer, and a second metal layer disposed on the first metal layer, th...