US Patent Issued to LG INNOTEK on April 7 for "Package substrate" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,599,017, issued on April 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Package substrate" was invented by Nam Heon Kim (Seoul, South Korea), Chang Je Kim (Seoul, South Korea) and Seong Hwan Im (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package substrate according to an embodiment includes a first substrate; and a first chip mounted on the first substrate; wherein the first substrate includes: a first insulating layer including a first region overlapping the first chip in a vertical direction and a second region other than the first region; and a circuit pattern disposed on the first region and the second region ...