ALEXANDRIA, Va., April 21 -- United States Patent no. 12,610,458, issued on April 21, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).

"Flexible printed circuit board, COF module, and electronic device comprising the same" was invented by Ki Tae Park (Seoul, South Korea), Chae Won Kang (Seoul, South Korea) and Man Ki Son (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A flexible printed circuit board according to an embodiment includes: a substrate; a conductive pattern disposed on the substrate; and a protective layer disposed on the conductive pattern. An upper surface of the substrate includes a first edge and a second edge facing along a first direction and each extending alon...