US Patent Issued to LG ENERGY SOLUTION on April 14 for "Wire bonding defect detection apparatus and operation method thereof" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,713, issued on April 14, was assigned to LG ENERGY SOLUTION LTD. (Seoul, South Korea).

"Wire bonding defect detection apparatus and operation method thereof" was invented by Jee Hoon Choi (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An apparatus and method are disclosed for detecting a bonding defect occurring during an ultrasonic wire bonding process between a battery cell and a busbar connected to each other by ultrasonic wire bonding. A bonding parameter collector, coupled to an ultrasonic wire bonding machine, may collect ultrasonic bonding parameters continuously during the ultrasonic wire bonding process, machine learn...