US Patent Issued to LG Electronics on Sept. 8 for "Heat pump" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,889, issued on Sept. 8, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Heat pump" was invented by Sangil Park (Seoul, South Korea), Jeongseob Shin (Seoul, South Korea), Seungtaek Oh (Seoul, South Korea) and Soojin Kang (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat pump may include: a compressor compressing refrigerant received from an accumulator; a water-refrigerant heat exchanger exchanging heat between the refrigerant discharged from the compressor and water; a main expansion valve expanding the refrigerant passed through the water-refrigerant heat exchanger; an outdoor heat exchanger exchanging heat betwee...