ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,824, issued on Sept. 1, was assigned to LG Electronics Inc. (Seoul, South Korea).

"Heat exchanger and heat exchanger manufacturing method" was invented by Hongseong Kim (Seoul, South Korea), Seungmo Jung (Seoul, South Korea), Sungwoo Kim (Seoul, South Korea) and Hanchoon Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to a heat exchanger comprising: a plurality of fin tubes which have heat transfer fins integrally formed with tubes in which a refrigerant flows; and a header which is coupled to the respective one end portions of the plurality of fin tubes. The header may comprise: a header main bod...