ALEXANDRIA, Va., May 12 -- United States Patent no. 12,627,033, issued on May 12, was assigned to LG Electronics Inc. (Seoul, South Korea).
"Antenna module implemented in multi-layered package" was invented by Yusuhk Suh (Seoul, South Korea), Dongik Lee (Seoul, South Korea) and Seungmin Woo (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "An antenna module includes: a printed circuit board (PCB) having a plurality of layers; an array antenna portion having a plurality of antenna elements disposed on the PCB; and a plurality of signal connection lines configured to electrically connect a radio frequency integrated circuit (RFIC) chip to the array antenna portion. A second patch antenna of tw...