US Patent Issued to LG Electronics, The Industry & Academic Cooperation in Chungnam National University (IAC) on July 7 for "Electronic device for performing bottom-up power line communication and method for operating same" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,676,568, issued on July 7, was assigned to LG Electronics Inc. (Seoul, South Korea) and The Industry & Academic Cooperation in Chungnam National University (IAC) (Daejeon, South Korea).

"Electronic device for performing bottom-up power line communication and method for operating same" was invented by Se Hwa Choe (Seoul, South Korea), Cha Seung Jun (Seoul, South Korea), Sung Yong Shin (Seoul, South Korea), Sun Ku Kwon (Seoul, South Korea) and Dong Hyun Lim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided an electronic device including a main body and a kit connected to the main body, and the main body includes a battery, a first...