US Patent Issued to LG CHEM on Sept. 8 for "Adhesive film for semiconductor and semiconductor package using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,324, issued on Sept. 8, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Adhesive film for semiconductor and semiconductor package using the same" was invented by Ki Beom Kim (Daejeon, South Korea), Min Su Jeong (Daejeon, South Korea), Jung Hak Kim (Daejeon, South Korea) and Eun Byurl Cho (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film for bonding semiconductors, which easily controls the fillet while exhibiting excellent adhesion force, and can prevent a problem in which solder is melted and fused to a chip; and a semiconductor package using the same."

The patent was filed on April 6, 2023, under Application No. 18/7...