US Patent Issued to LG CHEM on Sept. 15 for "Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,735,528, issued on Sept. 15, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Curing agent, adhesive composition for semiconductor comprising same, adhesive film for semiconductor, and semiconductor package using same" was invented by Seung Hee Nam (Daejeon, South Korea), Kwang Joo Lee (Daejeon, South Korea), Jung Hak Kim (Daejeon, South Korea), Eun Byurl Cho (Daejeon, South Korea) and Young Sam Kim (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a curing agent, an adhesive composition for a semiconductor device containing the curing agent, the adhesive composition exhibiting excellent adhesive ...