US Patent Issued to LG CHEM on Oct. 20 for "Thermoplastic resin composition and molded article thereof" (South Korean Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,767,812, issued on Oct. 20, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition and molded article thereof" was invented by Wangrae Joe (Daejeon, South Korea), Daeun Sung (Daejeon, South Korea), Tae Hoon Kim (Daejeon, South Korea), Chun Ho Park (Daejeon, South Korea), Yong Hee An (Daejeon, South Korea) and Jeongmin Jang (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a thermoplastic resin composition and a molded article including the same. More particularly, the present disclosure relates to a thermoplastic resin composition including 100 parts by weight of a styrene...