US Patent Issued to LG CHEM on July 7 for "Thermoplastic resin composition" (South Korean Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,674,013, issued on July 7, was assigned to LG CHEM Ltd. (Seoul, South Korea).

"Thermoplastic resin composition" was invented by Jeong Su Choi (Daejeon, South Korea), Won Seok Lee (Daejeon, South Korea), Roo Da Lee (Daejeon, South Korea), Sang Hoo Park (Daejeon, South Korea) and Jong Ju Lee (Daejeon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a thermoplastic resin composition which includes: a graft polymer including a rubber polymer having a gel content of 0 to 10 wt % and including an aromatic vinyl-based monomer unit and a diene-based monomer unit; and a shell including a (meth)acrylate-based monomer un...