ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,326, issued on April 7, was assigned to LG CHEM Ltd. (Seoul, South Korea).
"Thermoplastic resin composition" was invented by Jeong Su Choi (Daejeon, South Korea), Won Seok Lee (Daejeon, South Korea), Roo Da Lee (Daejeon, South Korea), Sang Hoo Park (Daejeon, South Korea), Jong Ju Lee (Daejeon, South Korea) and Seung Je Oh (Daejeon, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a thermoplastic resin composition which includes: a rubber polymer including a first styrene-based monomer unit and a diene-based monomer unit in a weight ratio of 10:90 to 35:65 and having an average particle diameter of 250 to 450 nm; a (meth)acrylat...