US Patent Issued to LENOVO (SINGAPORE) on July 14 for "Module mounting structure and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,681,542, issued on July 14, was assigned to LENOVO (SINGAPORE) PTE. LTD. (Singapore).

"Module mounting structure and electronic apparatus" was invented by Tadashi Kosuga (Yokohama, Japan) and Makoto Hashikura (Yokohama, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A module mounting structure includes: a cover that covers a front surface of a memory module on which a memory chip is mounted; a relay connector board that is located between a rear side of a part of the memory module where the memory chip is mounted and a substrate, and brings a large number of contact portions of the memory module and a large number of contact portions of the substr...