ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,720,712, issued on Aug. 25, was assigned to Lenovo (Singapore) Pte. Ltd. (Singapore).

"Liquid metal based thermal interface material" was invented by Mark Summerville (Morrisville, N.C.), Thomas Annunziata (Morrisville, N.C.), Justin Ringuette (Morrisville, N.C.), Mark Heidenfeldt (Morrisville, N.C.) and Sandy Collins (Morrisville, N.C.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer thermal interface material includes: a first metal layer comprising a first metal; a second metal layer comprising a second metal; and an interposed layer disposed between the first metal layer and the second metal layer. The first metal layer, the second metal ...